REDUCED OXIDATION SYSTEM FOR WIRE BONDING

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United States of America Patent

SERIAL NO

12788827

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Abstract

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A wire bonding machine is provided. The wire bonding machine includes (1) a bond site area for holding a semiconductor device during a wire bonding operation, and (2) a gas supply line configured to provide a gas at the bond site area from above the bond site area.

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Patent Owner(s)

Patent OwnerAddress
KULICKE AND SOFFA INDUSTRIES INC1005 VIRGINIA DRIVE FORT WASHINGTON PA 19034

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Frasch, E Walter Perkasie, US 9 52
Gillotti, Gary S Lansdale, US 18 207
Mak, Steven Philadelphia, US 3 47

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