Method for manufacturing capacitor embedded in interposer
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United States of America Patent
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Dec 7, 2010
Issued Date -
N/A
app pub date -
May 19, 2010
filing date -
Aug 30, 2007
priority date (Note) -
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Abstract
As for electrode pads for a semiconductor integrated circuit element, some of electrode pads for signal transmission are coupled to Ti films. Others of the electrode pads for signal transmission are coupled to electrode pads through wiring routed in multilayer wiring. Electrode pads for power supply are coupled to electrode pads to which power lines at potentials different from each other are coupled through wiring. The electrode pads are also coupled to Al foils (anodes). Electrode pads for grounding are coupled to electrode pads to which ground lines are coupled through wiring. The electrode pads are also coupled to conductive polymer films (cathodes).
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