INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL SIDED CONNECTION AND METHOD OF MANUFACTURE THEREOF
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United States of America Patent
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app pub date -
Mar 20, 2009
filing date -
Mar 20, 2009
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Abstract
A method of manufacture of an integrated circuit packaging system includes: attaching an integrated circuit having a through via over a substrate with the through via coupled to the substrate; attaching a conductive support over the substrate and adjacent to the integrated circuit; forming an encapsulation over the substrate with the conductive support exposed from the encapsulation; and attaching an external interconnect under the substrate.
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