Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
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United States of America Patent
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app pub date -
Feb 16, 2010
filing date -
Mar 31, 2003
priority date (Note) -
Abandoned
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Abstract
A manufacturing method for a wiring circuit board includes the steps of: forming a board on a surface of a metal layer directly or indirectly through an etching barrier layer; forming an insulating film on the surface of the metal layer; polishing the insulating film to an extent to which a top face of the bump is exposed; and forming a solder ball on the top face of the bump.
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