Methods of forming semiconductor devices including epitaxial layers and related structures

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United States of America Patent

PATENT NO 8288220
SERIAL NO

12412448

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Abstract

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A method of forming a semiconductor device may include forming a terminal region of a first conductivity type within a semiconductor layer of the first conductivity type. A well region of a second conductivity type may be formed within the semiconductor layer wherein the well region is adjacent at least portions of the terminal region within the semiconductor layer, a depth of the well region into the semiconductor layer may be greater than a depth of the terminal region into the semiconductor layer, and the first and second conductivity types may be different. An epitaxial semiconductor layer may be formed on the semiconductor layer, and a terminal contact region of the first conductivity type may be formed in the epitaxial semiconductor layer with the terminal contact region providing electrical contact with the terminal region. In addition, an ohmic contact may be formed on the terminal contact region. Related structures are also discussed.

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Patent Owner(s)

  • CREE, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hull, Brett Adam Raleigh, US 3 50
Zhang, Qingchun Cary, US 98 1722

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