Curatives for epoxy compositions

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United States of America Patent

PATENT NO 8431655
SERIAL NO

12815896

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Abstract

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The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions.

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Patent Owner(s)

  • DESIGNER MOLECULES, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dershem, Stephen M San Diego, US 93 2967

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