Method for slicing workpiece by using wire saw and wire saw
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United States of America Patent
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Oct 18, 2011
Grant Date -
Oct 7, 2010
app pub date -
Nov 17, 2008
filing date -
Dec 11, 2007
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present invention is a wire saw in which a wire for slicing is wound around a plurality of rollers to form a wire row; the wire for slicing is driven axially in a reciprocating direction; a workpiece is sliced simultaneously at a plurality of points arranged in an axial direction by feeding the workpiece against the wire row with the workpiece cut into while a slurry is supplied to the wire for slicing; the wire saw controlling in such a manner that the workpiece is extracted while the wire is caused to travel at a speed of 2 m/min or less at the time of extracting the workpiece from the wire row after slicing the workpiece. As a result, there is provided a wire saw in which the workpiece sliced with the wire row of the wire saw can be extracted from the wire row with a simple structure without a negative influence on its slicing surface.

First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SHIN-ETSU HANDOTAI CO LTD | TOKYO 100-0004 |
International Classification(s)

- [Classification Symbol]
- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Itoi, Yukio | Nishishirakawa, JP | 2 | 22 |
Kato, Tadahiro | Nishishirakawa, JP | 37 | 557 |
Kitagawa, Koji | Nishishirakawa, JP | 30 | 214 |
Sudou, Tomiichi | Nishishirakawa, JP | 1 | 21 |
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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