LED package with increased feature sizes
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United States of America Patent
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Oct 21, 2014
Grant Date -
Oct 7, 2010
app pub date -
Apr 9, 2010
filing date -
Oct 31, 2007
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A light emitter package having increased feature sizes for improved luminous flux and efficacy. An emitter chip is disposed on a submount with a lens that covers the emitter chip. In some cases, the ratio of the width of the light emitter chip to the width of said lens in a given direction is 0.5 or greater. Increased feature sizes allow the package to emit light more efficiently. Some packages include submounts having square dimensions greater than 3.5 mm used in conjunction with larger emitter chips. Materials having higher thermal conductivities are used to fabricate the submounts, providing the package with better thermal management.
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