METHOD FOR IMPROVED BRITTLE MATERIALS PROCESSING

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United States of America Patent

SERIAL NO

12732020

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Abstract

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An improved method for laser machining features in brittle materials such as glass is presented, wherein a tool path related to a feature is analyzed to determine how many passes are required to laser machine the feature using non-adjacent laser pulses. Laser pulses applied during subsequent passes are located so as to overlap previous laser spot locations by a predetermined overlap amount. In this way no single spot receives excessive laser radiation caused by immediately subsequent laser pulses being applied adjacent to a previous pulse location.

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Patent Owner(s)

Patent OwnerAddress
ELECTRO SCIENTIFIC INDUSTRIES INC13900 NW SCIENCE PARK DRIVE PORLTLAND OR 97229

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Howerton, Jeffrey Portland, US 22 371
Lei, Weisheng San Jose, US 13 353
Li, Guangyu Portland, US 17 332
Matsumoto, Hisashi Hillsboro, US 59 1134
Simenson, Glenn Tigard, US 20 466

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