EPOXY RESIN BLEND
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United States of America Patent
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app pub date -
Jun 30, 2009
filing date -
Apr 1, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Embodiments of the present disclosure set forth a prepreg. In one embodiment, the prepreg includes a fibrous material and a resin blend. The resin blend includes an epoxy compound, a compound having a ring structure, and a crosslinking agent. The resin blend has been heated to a temperature substantially greater than 225 degrees Celsius in a curing process when preparing the prepreg.
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