BONDED HERMETIC FEED THROUGH FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE
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United States of America Patent
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Issued Date -
Oct 14, 2010
app pub date -
Aug 28, 2009
filing date -
Apr 8, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A feed through for an active implantable medical device (AIMD). The feed through comprises first and second substantially planar, electrically non-conductive and fluid impermeable substrates usable for semiconductor device fabrication, each comprising: an aperture there through, and a contiguous metalized layer on the substrate surface that is co-existent with a section of the perimeter of the aperture and extends from the aperture; and a bond layer affixing the metalized layers of the first and second substrates to one another such that the apertures are not aligned with one another, and such that the metalized regions form a conductive pathway between the apertures.
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