CHEMICAL MECHANICAL FABRICATION (CMF) FOR FORMING TILTED SURFACE FEATURES
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United States of America Patent
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Issued Date -
Oct 14, 2010
app pub date -
Apr 13, 2010
filing date -
Apr 13, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of chemical-mechanical fabrication (CMF) for forming articles having tilted surface features. A substrate is provided having a patterned surface including two different layer compositions or a non-planar surface having at least one protruding or recessed feature, or both. The patterned surface are contacted with a polishing pad having a slurry composition, wherein a portion of surface being polished polishes at a faster polishing rate as compared to another portion to form at least one tilted surface feature. The tilted surface feature has at least one surface portion having a surface tilt angle from 3 to 85 degrees and a surface roughness<3 nm rms. The tilted surface feature includes a post-CMF high elevation portion and a post-CMF low elevation portion that defines a maximum height (h), wherein the tilted surface feature defines a minimum lateral dimension (r), and h/r is ≧0.05.
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