HEAT DISSIPATION DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20100263834A1
SERIAL NO

12512953

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A heat dissipation device includes a chamber, a tube, a wick structure and a plurality of fins arranged around the tube. The chamber includes a base and a cover hermetically connected to the base. An evaporation room is defined between the base and the cover of the chamber. The tube extends upwardly from the cover of the chamber, and defines a condensation room communicating with the evaporation room. The wick structure is immerged with working fluid, and includes a main portion disposed in the evaporation room and a projection extending from the main portion into the condensation room.

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Patent Owner(s)

Patent OwnerAddress
FOXCONN TECHNOLOGY CO LTD(236)NO 3-2 CHUNG SHAN ROAD TU-CHENG DIST NEW TAIPEI 236
FURUI PRECISE COMPONENT (KUNSHAN) CO LTDNO 635 FOXCONN ROAD HI-TECH INDUSTRY PARK DEVELOPMENT DISTRICT KUNSHAN CITY JIANGSU PROVINCE

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HUNG, JUI-WEN Tu-Cheng, TW 43 281
HWANG, CHING-BAI Tu-Cheng, TW 105 976
MENG, JIN-GONG Shenzhen City, CN 24 286

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