HIGH BANDWIDTH MEMORY INTERFACE

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United States of America Patent

SERIAL NO

12827691

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Abstract

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This invention describes an improved high bandwidth chip-to-chip interface for memory devices, which is capable of operating at higher speeds, while maintaining error free data transmission, consuming lower power, and supporting more load. Accordingly, the invention provides a memory subsystem comprising at least two semiconductor devices; a main bus containing a plurality of bus lines for carrying substantially all data and command information needed by the devices, the semiconductor devices including at least one memory device connected in parallel to the bus; the bus lines including respective row command lines and column command lines; a clock generator for coupling to a clock line, the devices including clock inputs for coupling to the clock line; and the devices including programmable delay elements coupled to the clock inputs to delay the clock edges for setting an input data sampling time of the memory device.

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Patent Owner(s)

Patent OwnerAddress
MOSAID TECHNOLOGIES INCORPORATED515 LEGGET DRIVE SUITE 100 OTTAWA K2K 3G4

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
GILLINGHAM, Peter Ottawa, CA 49 1502
MILLAR, Bruce Stittsville, CA 45 1874

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