Dual Interconnection in Stacked Memory and Controller Module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20100270668A1
SERIAL NO

12431569

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Abstract

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A chip package transmitting slow speed signals via edge connectors and high speed signals by means of through-silicon-vias. The edge connectors are formed in recesses formed in the sidewalls of the package.

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Patent Owner(s)

Patent OwnerAddress
WAFER-LEVEL PACKAGING PORTFOLIO LLC20400 STEVENS CREEK BLVD CUPERTINO CA 95014

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Marcoux, Phil P Mountain View, US 12 384

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