RINSE FORMULATION FOR USE IN THE MANUFACTURE OF AN INTEGRATED CIRCUIT
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United States of America Patent
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Issued Date -
Oct 28, 2010
app pub date -
Aug 23, 2006
filing date -
Aug 23, 2006
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a solution for treating a surface of a substrate for use in a semiconductor device. More particularly, the present invention relates to a liquid rinse formulation for use in semiconductor processing, wherein the liquid formulation contains: i. a surface passivation agent; and ii. an oxygen scavenger, wherein the pH of the rinse formulation is 8.0 or greater.
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