Reclosable Microwave-Suitable Packaging
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United States of America Patent
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Issued Date -
Nov 4, 2010
app pub date -
Jul 26, 2006
filing date -
Jul 27, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention relates to a packaging suited for heating in microwave ovens, ovens or double boilers, which is comprised of a multilayer film material having at least one area that is rendered permeable when an internal pressure generated by the microwave heating is exceeded. The invention is characterized in that this area is formed by a microperforation that is covered by a label or by a hot stamping film or by a varnish coating.
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