HEAT-PROCESSABLE THERMALLY CONDUCTIVE POLYMER COMPOSITION

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United States of America Patent

APP PUB NO 20100283001A1
SERIAL NO

12680985

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Abstract

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The present invention relates to a heat-processable thermally conductive polymer composition comprising (a) 30 to 95% by weight of a thermoplastic polymer (b) 5 to 40% by weight of a graphite powder; and (c) 0 to 65% by weight of optional further component(s), wherein the particles of the graphite powder are in the form of platelets having a thickness of less than 500 nm, and a process for the preparation heat-processable thermally conductive polymer composition.

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DSM IP ASSETS B V6411 TE HEERLEN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dijk, Van Hans K Sittard, NL 2 12
Janssen, Robert HC Beek, NL 10 66
Pot, Abel F Brunssum, NL 1 8

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