HEAT DISSIPATING PROTECTIVE SHEETS AND ENCAPSULANT FOR PHOTOVOLTAIC MODULES
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United States of America Patent
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Issued Date -
Nov 18, 2010
app pub date -
May 13, 2010
filing date -
May 14, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A photovoltaic module that resists or reduces unwanted increases in temperature of the photovoltaic cells encapsulated within the module is provided. This is accomplished by incorporating materials into module components that operate to direct heat away from the solar cells that are within the modules. One or more phase change materials are incorporated into the polymer layer of the backsheet that is position closest to the solar cells. Thermally conductive materials may be incorporated into the layers and/or module components closer to the outside of the module. These materials can be used separately or in conjunction with each other.
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