SILICONE LEADED CHIP CARRIER
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United States of America Patent
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N/A
Issued Date -
Nov 18, 2010
app pub date -
May 14, 2009
filing date -
May 14, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
In an embodiment, the invention provides a SLCC package comprising first and second electrically conductive terminals, a polysiloxane and glass fiber structural body, a light source and a polysiloxane encapsulant. The first and second electrically conductive terminals are attached to the polysiloxane and glass fiber structural body. The light source is electrically connected to the first and second electrically conductive terminals. The polysiloxane and glass fiber structural body has a cavity that contains at least a portion of the polysiloxane encapsulant.
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