LEAD-FREE HOT-DIP GALVANIZING METHOD AND PRODUCT
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United States of America Patent
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Issued Date -
Nov 18, 2010
app pub date -
Apr 27, 2007
filing date -
Apr 27, 2007
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Abandoned
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Abstract
In a lead-free hot-dip galvanizing method and its processed product, a pure zinc tablet with a 99.995% purity is used and a conventional zinc solution containing lead is changed to a novel hot-dip galvanizing zinc solution for the hot dip galvanizing process. The hot-dip galvanizing zinc solution has a composition of 98% to 99% of zinc, 0.2% to 1.0% of aluminum and less than 1% of a trace element by weight, so that this hot dip galvanizing process with a lead and cadmium free galvanizing condition is achieved.
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