DIAMOND TOOL AND METHOD FOR MANUFACTURING SEGMENT THEREOF

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20100294256A1
SERIAL NO

12515273

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to a diamond tool for cutting a workpiece. An object of the present invention is to provide a diamond tool, wherein a wear-resistant region is formed in a connection portion between a segment and a shank of the diamond tool to prevent an under-cut phenomenon, to extend the service life of the diamond tool and to improve cutting quality due to easy discharge of cut chips. A diamond tool of the present invention for achieving the object has a cutting segment that contains a plurality of diamond granules and is attached to an outer peripheral surface of a shank, wherein the segment comprises an auxiliary cutting portion that has a thickness identical with that of the shank and a height and is attached to the shank; and a primary cutting portion that is integrally formed on the top of the auxiliary cutting portion and has a thickness larger than that of the auxiliary cutting portion.

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Patent Owner(s)

Patent OwnerAddress
SHINHAN DIAMOND IND CO LTDINCHEON 21635

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Hyun Woo Incheon, KR 557 7890
Lim, Jae Wook Chungju-si, KR 1 3
Park, Bu Kun Bucheon-si, KR 1 3
Park, Jong Hwan Seoul, KR 60 400

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