CIRCUIT BOARD AND METHOD FOR A LOW PROFILE WIRE CONNECTION
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United States of America Patent
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-
N/A
Issued Date -
Nov 25, 2010
app pub date -
May 22, 2009
filing date -
May 22, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A printed circuit board includes a first layer including a groove formed therein. The groove extends between opposing face surfaces. A second layer is coupled with one face surface of the first layer. The second layer includes a through hole in communication with the groove of the first layer. A third layer is coupled to other face surface of the first layer opposite the second layer. Portions of the second and third layers cooperate with the groove and forming a cavity with an opening at the edge of the board. The cavity is accessible through the through hole of the second layer. A printed circuit board includes multiple layers which are coupled together. A wire is electronically coupled to the printed circuit board by being inserted into the cavity with solder applied via the through hole. An alternative embodiment utilizes two layers to define the board and cavity.
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