Silicon microphone package
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United States of America Patent
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Oct 29, 2013
Grant Date -
Dec 2, 2010
app pub date -
May 25, 2010
filing date -
May 29, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A silicon microphone package is provided, including an integrated microphone die having opposing first and second surfaces, a first cover member formed over the first surface of the integrated microphone die to form a first chamber therebetween, and a second cover member formed over the second surface of the integrated microphone die to form a second chamber therebetween.
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