US Patent Application No: 2010/0314,076

Number of patents in Portfolio can not be more than 2000

Apparatus and Method for Rapid Cooling of Large Area Substrates in Vacuum

ALSO PUBLISHED AS: 8302554

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Abstract

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The present invention is directed to an apparatus and method for rapid cooling of a large substrate in a vacuum environment. A first cooled plate is brought into close proximity with one surface of a flat substrate. The spatial volume between the first cooling plate and the substrate is sealed and brought to a higher pressure than the surrounding vacuum level to increase the cooling efficiency. A second cooled plate is brought into close proximity with the opposite surface of the flat substrate. A second spatial volume between the second cooling plate and the substrate is sealed and the gas pressure is equalized to the gas pressure in the first spatial volume. The equalization of the gas pressure on both sides of the flat substrate eliminates deflection of the substrate and bending stress in the substrate.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
COLORADO STATE UNIVERSITY RESEARCH FOUNDATIONFORT COLLINS, CO143

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Barth, Kurt L Ft. Collins, CO 14 202
Enzenroth, Robert A Fort Collins, CO 13 201
Sampath, Walajabad S Fort Collins, CO 16 243

Cited Art Landscape

Patent Info (Count) # Cites Year
 
ANELVA CORPORATION (1)
* 6,250,374 Apparatus and method for treating substrates 5 1998
 
INTEVAC, INC. (1)
* 5,181,556 System for substrate cooling in an evacuated environment 29 1991
 
SEAGATE TECHNOLOGY LLC (1)
* 2004/0250,996 Method and apparatus for cooling a planar workpiece in an evacuated environment with dynamically moveable heat sinks 2 2004
 
VARIAN ASSOCIATES, INC. (1)
* 4,909,314 Apparatus for thermal treatment of a wafer in an evacuated environment 52 1987
* Cited By Examiner

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