Apparatus and method for rapid cooling of large area substrates in vacuum

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8302554
APP PUB NO 20100314076A1
SERIAL NO

12861391

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Abstract

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The present invention is directed to an apparatus and method for rapid cooling of a large substrate in a vacuum environment. A first cooled plate is brought into close proximity with one surface of a flat substrate. The spatial volume between the first cooling plate and the substrate is sealed and brought to a higher pressure than the surrounding vacuum level to increase the cooling efficiency. A second cooled plate is brought into close proximity with the opposite surface of the flat substrate. A second spatial volume between the second cooling plate and the substrate is sealed and the gas pressure is equalized to the gas pressure in the first spatial volume. The equalization of the gas pressure on both sides of the flat substrate eliminates deflection of the substrate and bending stress in the substrate.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
COLORADO STATE UNIVERSITY RESEARCH FOUNDATIONFORT COLLINS, CO199

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Barth, Kurt L Fort Collins, US 13 274
Enzenroth, Robert A Fort Collins, US 8 267
Sampath, Walajabad S Fort Collins, US 11 302

Cited Art Landscape

Patent Info (Count) # Cites Year
 
COLORADO STATE UNIVERSITY RESEARCH FOUNDATION (2)
6423565 Apparatus and processes for the massproduction of photovotaic modules 107 2000
2008/0075,853 Apparatus and method for rapid cooling of large area substrates in vacuum 1 2006
 
NOVELLUS SYSTEMS, INC. (1)
6483081 In-line cure furnace and method for using the same 9 2000
 
SOKUDO CO., LTD. (1)
2007/0254,493 Integrated thermal unit having vertically arranged bake and chill plates 3 2006
 
SEAGATE TECHNOLOGY LLC (1)
* 2004/0250,996 Method and apparatus for cooling a planar workpiece in an evacuated environment with dynamically moveable heat sinks 2 2004
 
VEECO ROCHESTER INC. (1)
6907924 Thermally conductive chuck for vacuum processor 8 2002
 
INTEVAC, INC. (1)
* 5181556 System for substrate cooling in an evacuated environment 29 1991
 
ANELVA CORPORATION (1)
* 6250374 Apparatus and method for treating substrates 5 1998
 
VARIAN ASSOCIATES, INC. (1)
* 4909314 Apparatus for thermal treatment of a wafer in an evacuated environment 53 1987
 
TOKYO ELECTRON LIMITED (1)
2007/0209,591 SUBSTRATE PROCESSING SYSTEM, SUBSTRATE SURFACE PROCESSING APPARATUS, SUBSTRATE SURFACE INSPECTING APPARATUS, SUBSTRATE SURFACE INSPECTING METHOD, AND STORAGE MEDIUM STORING PROGRAM FOR IMPLEMENTING THE METHOD 4 2007
 
CANON KABUSHIKI KAISHA (1)
2007/0140,671 Cooling Device, and Apparatus and Method for Manufacturing Image Display Panel Using Cooling Device 24 2007
* Cited By Examiner

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