METHOD FOR PREPARING POLYIMIDE AND POLYIMIDE PREPARED USING THE SAME
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United States of America Patent
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Issued Date -
Dec 16, 2010
app pub date -
Jan 18, 2008
filing date -
Feb 9, 2007
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Abandoned
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Abstract
The present invention relates to a method for preparing polyimide having excellent heat resistance and processibility and, more particularly, to a method of preparing polyimide which has desirable mechanical strength during curing at low temperatures and excellent processibility to be used as an insulating film of a metal laminate plate or a coverlay film for print substrates or hard disks, and polyimide prepared using the same.
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