HIGHLY VERSATILE MACHINE-TO-MACHINE CONNECTIVITY MODULE
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United States of America Patent
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Issued Date -
Dec 16, 2010
app pub date -
Jan 20, 2009
filing date -
Feb 14, 2008
priority date (Note) -
Abandoned
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Abstract
A machine-to-machine connectivity module comprising a first printed circuit that comprises the electronic components for providing a communications module and an element for accommodating a SIM card, the accommodation element being superimposed on the first printed circuit.
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