COMPOSITE MATERIAL HAVING HIGH THERMAL CONDUCTIVITY ND PROCESS OF FABRICATING SAME
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United States of America Patent
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app pub date -
Aug 24, 2010
filing date -
Oct 21, 2009
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Abstract
The invention relates to high thermal conductivity (TC) materials, in particular, to copper-diamond composite materials, which can be used as heat exchangers, heat sinks, heat spreaders for electronic and other devices and a method of production thereof. A high TC diamond-metal composite according to the invention has a TC above 500 W/(m*K) and comprises coated diamond particles in a metal or metal alloy matrix having a TC of not less than 300 W/(m*K), wherein the particles are coated with a single-layered continuous high surface area coating comprising a metal and/or carbide of a carbide-forming element selected from IV-VI Groups of the Periodic Table, the coating having a thickness of less than 500 nm and a certain surface texture to provide high TC of composite.
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