COMPOSITE MATERIAL HAVING HIGH THERMAL CONDUCTIVITY ND PROCESS OF FABRICATING SAME

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20100319900A1
SERIAL NO

12861861

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention relates to high thermal conductivity (TC) materials, in particular, to copper-diamond composite materials, which can be used as heat exchangers, heat sinks, heat spreaders for electronic and other devices and a method of production thereof. A high TC diamond-metal composite according to the invention has a TC above 500 W/(m*K) and comprises coated diamond particles in a metal or metal alloy matrix having a TC of not less than 300 W/(m*K), wherein the particles are coated with a single-layered continuous high surface area coating comprising a metal and/or carbide of a carbide-forming element selected from IV-VI Groups of the Periodic Table, the coating having a thickness of less than 500 nm and a certain surface texture to provide high TC of composite.

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International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abyzov, Andrey Mikhailovich Saint Petersburg, RU 1 1

Cited Art Landscape

Patent Info (Count) # Cites Year
 
NORTON COMPANY (1)
* 5096465 Diamond metal composite cutter and method for making same 173 1989
 
Skeleton Technologies AG (1)
* 6914025 Heat conductive material 8 2001
 
NANO MATERIALS INTERNATIONAL CORPORATION (1)
* 7279023 High thermal conductivity metal matrix composites 3 2003
 
LAWRENCE LIVERMORE NATIONAL SECURITY, LLC (2)
* 6264882 Process for fabricating composite material having high thermal conductivity 14 1994
* 5783316 Composite material having high thermal conductivity and process for fabricating same 43 1996
 
CRYSTALLUME (1)
* 5902675 Diamond film and solid diamond particle composite compositions 3 1994
 
SUMITOMO ELECTRIC INDUSTRIES, LTD. (3)
* 5299214 Heat radiating component and semiconductor device provided with the same 20 1992
* 6171691 Heat sink material for use with semiconductor component and method for fabricating the same, and semiconductor package using the same 24 1998
* 6031285 Heat sink for semiconductors and manufacturing process thereof 18 1998
 
SILICON VALLEY BANK (1)
* 5273790 Method for consolidating diamond particles to form high thermal conductivity article 23 1992
 
Agency for Science, Technology and Research (1)
* 4902652 Method for production of a sintered article of diamond 8 1988
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (1)
* 2011/0114,285 COPPER-NIOBIUM, COPPER-VANADIUM, OR COPPER-CHROMIUM NANOCOMPOSITES, AND THE USE THEREOF IN HEAT EXCHANGERS 12 2010
 
DENKI KAGAKU KOGYO KABUSHIKI KAISHA (2)
* 8890189 Wafer for LED mounting, method for manufacturing same, and LED-mounted structure using the wafer 0 2010
* 2012/0168,802 WAFER FOR LED MOUNTING, METHOD FOR MANUFACTURING SAME, AND LED-MOUNTED STRUCTURE USING THE WAFER 2 2010
 
DIAMOND INNOVATIONS, INC. (1)
* 2012/0100,366 WEAR RESISTANT COATINGS CONTAINING PARTICLES HAVING A UNIQUE MORPHOLOGY 3 2011
* Cited By Examiner