INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONTACT PADS AND METHOD OF MANUFACTURE THEREOF
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United States of America Patent
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app pub date -
Jun 19, 2009
filing date -
Jun 19, 2009
priority date (Note) -
Abandoned
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Abstract
A method of manufacture of an integrated circuit packaging system includes: attaching contact pads to a base structure; connecting a base die to the base structure; connecting a supporting die over the base die by conductive balls to the contact pads on two sides of the base die; encapsulating the contact pads, the base die, the supporting die, and the conductive balls; and removing the base structure.
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