Adhesive compositions containing bond-strength enhancing agent and methods for producing woody board using adhesive compositions
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United States of America Patent
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Issued Date -
Dec 30, 2010
app pub date -
Jun 9, 2010
filing date -
Jun 24, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Improved adhesives with significantly-enhanced bond strength is provided in accordance with the present invention, in particular by adding a bond-strength enhancing agent comprising particles to a binder. Such adhesives can be used in a process of producing a woody board, which results in a substantial reduction in amount of the adhesive used, thus leading to a reduction in overall woody board production costs. Methods for producing a woody board are also provided. The method includes the steps of: coating or spraying an adhesive composition on a wood raw material that is an aggregate composed of wood chips; forming the wood raw material coated or sprayed with the adhesive composition into a specified shape; and heat-pressing the wood raw material formed into the specified shape and again forming the heat-pressed wood raw material into the specified shape. The adhesive composition is obtained by adding a bond-strength enhancing agent composed of particles to an adhesive.
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