Plane-type heat-dissipating structure with high heat-dissipating effect and method formanufacturing the same
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United States of America Patent
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Issued Date -
Dec 30, 2010
app pub date -
Jun 30, 2009
filing date -
Jun 30, 2009
priority date (Note) -
Abandoned
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Abstract
A plane-type heat-dissipating structure with high heat-dissipating effect includes a first heat-dissipating unit and a second heat-dissipating unit. The first heat-dissipating unit has an evacuated hollow heat-dissipating body, a plurality of supports integratedly formed in the hollow heat-dissipating body in order to divide an inner space of the hollow heat-dissipating body into a plurality of receiving spaces, and a plurality of microstructures integratedly formed on an inner surface of the hollow heat-dissipating body. Work liquid is filled into the receiving spaces. The second heat-dissipating unit is integratedly formed on an outer surface of the first heat-dissipating unit.
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