LED PACKAGE STRUCTURE FOR FORMING A STUFFED CONVEX LENS TO ADJUST LIGHT-PROJECTING ANGLE AND METHOD FOR MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Jan 6, 2011
app pub date -
Sep 10, 2009
filing date -
Jul 6, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An LED package structure includes a substrate unit, a light-emitting unit, a light-reflecting unit and a convex package unit. The substrate unit has a substrate body and a chip-placing area. The light-emitting unit has a plurality of LED chips electrically disposed on the chip-placing area. The light-reflecting unit has an annular reflecting resin body surroundingly formed on the substrate body by coating. The annular reflecting resin body surrounds the LED chips that are disposed on the chip-placing area to form a resin position limiting space above the chip-placing area, and the annular reflecting resin body has an inner surface that has been cleaned by plasma to form a clean surface. The convex package unit has a convex package resin body disposed on the substrate body in order to cover the LED chips. The position of the convex package resin body is limited in the resin position limiting space.
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