HEAT TRANSPORT DEVICE MANUFACTURING METHOD AND HEAT TRANSPORT DEVICE

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United States of America Patent

APP PUB NO 20110005724A1
SERIAL NO

12867967

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Abstract

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[Object] To provide a heat transport device manufacturing method and a heat transport device that has a high hermeticity and is manufactured without increasing a load applied at a time of performing diffusion bonding.) having a high hermeticity can be manufactured without increasing an entire load (F) applied at the time of the diffusion bonding.

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Patent Owner(s)

Patent OwnerAddress
SONY CORPORATION1-7-1 KONAN MINATO-KU TOKYO 108-0075
SONY CHEMICAL & INFORMATION DEVICE CORPORATIONTOKYO 141-0032

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirata, Koji Tokyo, JP 343 2351
Kasai, Hiroto Tokyo, JP 22 152
Ryoson, Hiroyuki Tokyo, JP 31 435
Yajima, Takashi Tokyo, JP 49 698

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