HEAT DISSIPATION MODULE
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United States of America Patent
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Issued Date -
Jan 13, 2011
app pub date -
Sep 15, 2009
filing date -
Jul 7, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heat dissipation module comprises a heat pipe forming a condensing section, and a first fin unit and a second fin unit contacting with the condensing section of the heat pipe. The first and second fin units are located neighboring to each other and have different heights. The first and second fin units each comprise a plurality of fins stacked together. A protruding member protrudes from one of the fins of one of the first and second fin units to abut a corresponding neighboring one of the fins of the other one of the first and second fin units, to thereby separate the first fin unit and the second fin unit to limit relative movement of the first fin unit and the second fin unit in a protruding direction of the protruding member.
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