Dispensing systems for dispensing a heated liquid
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 16, 2012
Grant Date -
Jan 13, 2011
app pub date -
Sep 17, 2010
filing date -
Jan 28, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Systems for dispensing heated liquids, such as hot melt adhesives. The dispensing system may include a hot air manifold and a liquid manifold with a surface confronting surfaces of the air manifold to define an air plenum. A dispensing module is coupled in fluid communication with the liquid manifold and in fluid communication with an air outlet of the hot air manifold. The dispensing module is capable of dispensing the heated liquid and is capable of receiving and dispensing the process air to impinge upon the heated liquid. A heating element is operative for heating the process air flowing through said air plenum.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully