TREATED ELECTRICAL CONDUIT
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United States of America Patent
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Issued Date -
Jan 20, 2011
app pub date -
Jul 20, 2009
filing date -
Jul 20, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An improved electrical conduit having a protective material thereon for anti-microbial and antifungal prevention. The metallic conduit includes a metal armor defining an outer surface and an interior hollow area within which electrical conductors are disposed. A first polymeric layer is formed over the outer surface of the metal armor. A second polymeric layer is extruded over the first polymeric layer. The first and/or second polymeric layers may be formed with an anti-microbial and/or anti-fungal additive. In addition, the first polymeric layer may have a first color and the second polymeric layer may have a second color where the first color is different from the second layer sufficient for the first color to be visible when the second polymeric layer is compromised.
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