MULTI-DENSITY POLYMERIC INTERBODY SPACER
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United States of America Patent
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Issued Date -
Jan 20, 2011
app pub date -
Jul 14, 2009
filing date -
Jul 14, 2009
priority date (Note) -
Abandoned
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Abstract
A multi-density polymeric interbody spacer formed from biocompatible material for osteoconductivity includes multiple density regions of different porosity to provide both strength and osteoconductivity. An interface region is formed between the density regions to provide both direct adhesion and mechanical interlocking between the different density regions to increase the strength of the multi-density polymeric interbody spacer. A method for forming the multi-density polymeric interbody spacer includes curing a first density region to achieve a first target porosity. A second density region may then be molded to the first density region to achieve a second target porosity. A portion of the second density region partially flows into pores of the first density region, providing direct adhesion and mechanical interlocking between the first and second density regions.
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