ELECTROCHEMICAL ETCHING AND POLISHING OF CONDUCTIVE SUBSTRATES
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United States of America Patent
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Issued Date -
Jan 27, 2011
app pub date -
Jul 27, 2010
filing date -
Jul 27, 2009
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Abandoned
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Abstract
A method for electrochemically etching a metal layer through an etch-resist layer pattern using a non-active electrolyte solution is described. The method is particularly useful in fabrication of advanced fuel delivery systems for land-based power generation turbines and aerospace turbine engines; of components for advanced thermal management in aerospace electronic devices and in cooling channels; of stents used in medicine; and of microchannels for sensors, chemical reactors, and dialysis and the like. In one embodiment of the invention the metal layer is copper and the non-active electrolyte solution is a mixture of sodium nitrate and sodium chloride and a pulse electric current is employed to accomplish the electrochemical etching.
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