METHOD OF ELECTRICALLY CONNECTING A WIRE TO A PAD OF AN INTEGRATED CIRCUIT CHIP AND ELECTRONIC DEVICE
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United States of America Patent
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Issued Date -
Jan 27, 2011
app pub date -
Jul 26, 2010
filing date -
Jul 27, 2009
priority date (Note) -
Abandoned
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Abstract
A wire is electrically connected to an electrical bonding pad of an integrated circuit chip and electronic device through an intermediate electrical interconnect block that is interposed between the electrical bonding pad and one end of the electrical lead wire.
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