OVERMOLDED TEMPERATURE SENSOR AND METHOD FOR FABRICATING A TEMPERATURE SENSOR

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20110019714A1
SERIAL NO

12509343

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An exemplary embodiment of a temperature sensor includes housing, and a solid state temperature sensing device disposed within the housing. A first wiring conductor makes electrical connection from outside the housing to a first terminal of the sensing device. A second wiring conductor makes electrical connection outside the housing to a second terminal of the device. The housing is an over-molded plastic structure encapsulating the sensing device and portions of the first and second wiring conductors. The plastic structure is fabricated of a thermally conductive material. A method for fabricating a temperature sensor positioning a sensor assembly including an elongated circuit board, a solid state sensing device mounted to a tip of the circuit board, and a portion of a cable assembly electrically connected to the circuit board within a mold assembly defining a housing cavity. Molten plastic material is injected into the housing cavity to encapsulate the circuit board, the solid state sensing device and the portion of the cable assembly. The plastic material is thermally conductive and electrically non-conductive. The molten plastic material cools to form a housing structure protecting the sensing device.

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Patent Owner(s)

Patent OwnerAddress
BALBOA WATER GROUP INC1382 BELL AVENUE TUSTIN CA 92780

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Perry, Loren R Fountain Valley, US 13 190

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