METHOD FOR MAKING SEMICONDUCTOR CHIPS HAVING COATED PORTIONS
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United States of America Patent
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app pub date -
Aug 3, 2010
filing date -
May 22, 2007
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Abandoned
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Abstract
A method for making semiconductor chips having coated portions can include mounting the chips in lead frames, stacking the lead frames in an orientation in which a portion of one lead frame masks a portion of a chip mounted on another lead frame but leaves another portion of the chip mounted on the other lead frame exposed to receive a coating, and depositing a coating on the stacked lead frames using, for example, an evaporative coating machine. In this manner, the coating is deposited on exposed portions of chips, such as its edges, and is not deposited on masked portions of chips, such as bond pads.
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