SUBSTRATE PROCESSING PALLET WITH COOLING
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United States of America Patent
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app pub date -
Oct 8, 2010
filing date -
Mar 9, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In one exemplary embodiment, a substrate processing pallet is provided. The substrate processing pallet includes a base member, and an interface pad attachable to the base member. The interface pad has substantially the same coefficient of thermal expansion as the base member and adapted to facilitate cooling of the substrate. The substrate processing pallet also having a surface of the base member having features for aligning a substrate on the interface pad.
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