ENCAPSULATED LENS STACK
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United States of America Patent
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N/A
Issued Date -
Feb 10, 2011
app pub date -
Nov 18, 2008
filing date -
Nov 27, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A wafer scale package includes two or more substrates (wafers) that are stacked in an axial direction and a plurality of replicated optical elements. An optical device includes one or more optical elements. The wafer scale package and the device include one or more cavities that house the optical elements, while the end faces of the package or the device are planar and do not have replicated optical elements thereon. The number of double sided substrates is reduced, and design and manufacture of the optical device is improved.
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