CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
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United States of America Patent
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Issued Date -
Feb 10, 2011
app pub date -
Aug 6, 2009
filing date -
Aug 6, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides a conductor package structure comprising a conductive base. An adhesive layer is formed on the conductive base. An electronic element is formed on the adhesive layer. Conductors are forming signal connection between the surface of a filling material and the bottom of the filling material, wherein the filling material is filled in the space between the electronic element and the conductors.
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