METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT
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United States of America Patent
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Issued Date -
Feb 17, 2011
app pub date -
Jul 20, 2010
filing date -
Aug 12, 2009
priority date (Note) -
Abandoned
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Abstract
An emitter wrap-through solar cell may include a semiconductor substrate having a first side, and a second side opposite the first side, contact structures having at least one emitter contact, and at least one base contact, wherein both the at least one emitter contact and the at least one base contact are arranged on the second side of the semiconductor substrate, and the contact structures have a metallization having nickel silicide.
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