MODULAR SOLDERING APPARATUS
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United States of America Patent
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Issued Date -
Feb 17, 2011
app pub date -
Aug 28, 2008
filing date -
Aug 28, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In a modular soldering apparatus a pump assembly (4) comprising a pump (67, 71) conduit 66 and solder nozzle (92) is removable as a unit and push contacts (42, 52') which are broken by lifting the assembly are provided for the electrical, data and gas connections (80, 90). A solder bath (10) is also mounted on a support structure (16) and connected to data and power supplies (42) by push fit connections. The pump assembly and solder bath may be coupled together and removed as single unit.
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