Semiconductor device and method of fabricating semiconductor device
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United States of America Patent
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Feb 7, 2012
Grant Date -
Feb 17, 2011
app pub date -
Oct 19, 2010
filing date -
Oct 18, 2007
priority date (Note) -
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Abstract
A method of fabricating a semiconductor device from a semiconductor wafer, having external connecting terminals on one side of the semiconductor wafer and a cover layer on another side of the semiconductor wafer, includes forming a groove with a first width from the one side to at least an interface between the semiconductor wafer and the cover layer in the semiconductor wafer, and cutting the cover layer with a second width from a bottom side of the groove. The second width is narrower than the first width.
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