Importance

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Abstract

A substrate is secured on a chuck that maintains a top surface of the substrate in a substantially level orientation. The chuck is positioned within a cavity of a vessel such that a body portion of the chuck is maintained in a spaced apart relationship with a surface of the cavity. An electroless plating solution is disposed in a region between the body portion of the chuck and the surface of the cavity such that an upper surface of the electroless plating solution is at a level lower than the substrate. The chuck is lowered within the cavity to cause the electroless plating solution to be displaced upward and flow over the top surface of the substrate in a substantially uniform manner from a periphery of the substrate to a center of the substrate. The chuck is then raised such that the electroless plating solution flows off of the substrate.

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First Claim