HEAT DISSIPATION DEVICE
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United States of America Patent
Stats
-
N/A
Issued Date -
Mar 3, 2011
app pub date -
Oct 19, 2009
filing date -
Aug 26, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A heat dissipation apparatus includes a flat heat pipe and a plurality of fins stacked together. Each fin defines a substantially rectangular-shaped receiving hole therein for receiving a condenser section of the flat heat pipe and a small-sized accommodating hole therein for accommodating a solder paste. A combining sidewall extends from an edge of the receiving hole, and includes elongated top and bottom planar plates, and a short plate extending from one end of the bottom planar plate towards the top planar plate. The accommodating hole is located at a junction of the top planar plate and the short plate. The solder paste accommodated in the accommodating hole is melted to flow into the receiving hole to fill up a clearance between the flat heat pipe and the combining sidewall to combine the flat heat pipe and the fins together.
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