SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Mar 3, 2011
app pub date -
Aug 23, 2010
filing date -
Aug 26, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of producing a semiconductor package includes setting a radiator member on a semiconductor device that is mounted on a wiring board, said radiator member having a convex surface part on at least a part of a first surface thereof opposite to a second surface thereof to be bonded to the semiconductor device, and pressing the convex surface part of the radiator member towards the semiconductor device in order to align the radiator member and the semiconductor device automatically and to become substantially parallel to each other.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully